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Микросхема KLM8G1GEND-B031, KLM8G1WE4A-A001, KLM8G1WEMB-B011, KLM8G1WEMB-B031, KLM8G1WEPD-B031, KLM8G2FE3B-B001, KLM8G2FEJA-A001 1 шт./лот

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08-09-2019 в 23:53
428,94 - 667,23 руб
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Описание

Купить Микросхема KLM8G1GEND-B031, KLM8G1WE4A-A001, KLM8G1WEMB-B011, KLM8G1WEMB-B031, KLM8G1WEPD-B031, KLM8G2FE3B-B001, KLM8G2FEJA-A001 1 шт./лот

FEATURES

embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard

SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

- Non-supported Features : Large Sector Size (4KB)

Additional features of eMMC5.0 : HS400 mode (200MHz DDR - up to 400Mbps), Field Firmware Update,

Device Health Report, Sleep Notification, Secure Removal Type

Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)

Data bus width : 1bit (Default), 4bit and 8bit

MMC I/F Clock Frequency : 0 ~ 200MHz

MMC I/F Boot Frequency : 0 ~ 52MHz

Temperature : Operation (-25 C ~ 85 C), Storage without operation (-40 C ~ 85 C)

Power : Interface power VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power VDDF(VCC) (2.7V ~ 3.6V)

Datasheet

Детали объявления

3236

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