THGBMBG5D1KBAIL has the JEDEC/MMCZ Version 5.0 interfaca with 1-I/O, 4-I/o and 8-I/O mode.
P-WFBGA153-1113-0.50 (11.5mmx13mm, H0.8mm max.package)
Operating Temperature and Humidity Conditions
-25 C to +85 C, and 0%RH to 95%RH non-condensing
Storage Temperature and Humidity Conditions
-40 C to +85 C, and 0%RH to 95%RH non-condensing
Vcc= 2.7V to 3.6V
VccQ= 1.7V to 1.95V / 2.7V to 3.6V
THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.