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Микросхема MT29F2G08ABAEA TSOP48 NAND Flash 1 шт./лот - Объявления на сайт

Микросхема MT29F2G08ABAEA TSOP48 NAND Flash 1 шт./лот

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Добавлено 2019-09-11 06:42:11


Купить Микросхема MT29F2G08ABAEA TSOP48 NAND Flash 1 шт./лот


• Open NAND Flash Interface (ONFI) 1.0-compliant1

• Single-level cell (SLC) technology

• Organization

– Page size x8: 2112 bytes (2048 + 64 bytes)

– Page size x16: 1056 words (1024 + 32 words)

– Block size: 64 pages (128K + 4K bytes)

– Plane size: 2 planes x 1024 blocks per plane

– Device size: 2Gb: 2048 blocks

• Asynchronous I/O performance

– tRC/tWC: 20ns (3.3V), 25ns (1.8V)

• Array performance

– Read page: 25μs 3

– Program page: 200μs (TYP: 1.8V, 3.3V)3

– Erase block: 700μs (TYP)

• Command set: ONFI NAND Flash Protocol

• Advanced command set

– Program page cache mode4

– Read page cache mode 4

– One-time programmable (OTP) mode

– Two-plane commands 4

– Interleaved die (LUN) operations

– Read unique ID

– Block lock (1.8V only)

– Internal data move

• Operation status byte provides software method for


– Operation completion

– Pass/fail condition

– Write-protect status

• Ready/Busy# (R/B#) signal provides a hardware

method of detecting operation completion

• WP# signal: Write protect entire device

• First block (block address 00h) is valid when shipped

from factory with ECC. For minimum required

ECC, see Error Management.

• Block 0 requires 1-bit ECC if PROGRAM/ERASE cycles

are less than 1000

• RESET (FFh) required as first command after poweron

• Alternate method of device initialization (Nand_Init)

after power up (contact factory)

• Internal data move operations supported within the

plane from which data is read

• Quality and reliability

– Data retention: 10 years

• Operating voltage range

– VCC: 2.7–3.6V

– VCC: 1.7–1.95V

• Operating temperature:

– Commercial: 0°C to +70°C

– Industrial (IT): –40єC to +85єC

• Package

– 48-pin TSOP type 1, CPL2

– 63-ball VFBGA


Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (I/Ox) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control

hardware write protection and monitor device status (R/B#). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities

with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or

more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). There is at least one NAND Flash die per chip enable signal. For further details, see Device and Array Organization.

This device has an internal 4-bit ECC that can be enabled using the GET/SET features or by factory (always enabled). See Internal ECC and Spare Area Mapping for ECC for more information.


Детали объявления

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Истекает: 2035-11-10 06:42:00


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